(EAC)OLED Film Laser Cutting Equipment
The equipment utilizes laser to cut the entire flexible substrate (maximum size: 1500mm x 925mm) into cells of a specified size & number and then discharge them. The equipment comprises a substrate feeding unit, a laser cutting unit, a waste removal unit, a turntable unit and an unloading unit.
Equipment Advantages
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01Synchronous cutting with multiple laser heads to improve cutting efficiency
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02Utilize ultra-short pulse laser processing to reduce damage to the product
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03The hardware is independently developed and manufactured by Maxwell, which can guarantee the delivery and be convenient for customization and upgrading
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04Independent software development, friendly interface, unique multi-matrix fusion parallel algorithm
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05Equipped with cutting dust removal and product, platform cleaning function, and excellent particle removal effect
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06Equipped with the function of rework processing of abnormal pieces
Equipment Picture
Basic Parameters
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1. Applicable products : flexible OLED
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2. Applicable product size : 1~13 inches(25mmx25mm~300mmx300mm)
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3. Tack Time : ≤ 3S (95 pcs) based on 6 inches
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4. CO2 laser cutting accuracy : ≤±30μm
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5. UV laser cutting accuracy : ≤±30μm
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6. Coincidence degree : ≤ ± 15μm
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7. GP laser cutting accuracy : ≤ ± 30μm
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8. CO2 cutting unilateral heat influence range : ≤70μm
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9. UV cutting unilateral heat influence range : ≤40μm
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10. Green laser cutting unilateral heat influence range : ≤20μm
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