Mini LED Wafer Laser Stealth Cutting Equipment
This equipment is mainly used for LED blue-green sapphire wafer cutting and processing, internal quality modification. The equipment includes automatic loading and unloading units, counterpoint unit, a laser Stealth Cutting unit and a control unit.
Main Advantages
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01Equipped with high precision linear motor, high speed X-Y movement platform
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02Unattended fully automatic processing for both normal wafer and debris
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03Independent research and development of DFT technology, high efficiency and high quality processing
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Equipment Picture
Basic Parameters
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1. High machining accuracy: Cut size edges ≤ 1.5μm
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2. High processing efficiency: Max Running Speed 1000mm/s
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3. Good Cutting: Cut wavy lines ≤ ± 2μm
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4. Machinable wafer size: 2 ~ 6 inches of wafer, capability of stealth cutting for minimum cutting path of 12μm
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5. Product compatibility: Machinable traditional LED Sapphire Wafer and Mini LED wafer
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6. Easy maintenance of the equipment: utilizing bus control system, self-diagnosis system, with low failure rate, high stability and high maintainability
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7. Design/Manufacturing/Maintenance integration to ensure the consistency, stability and rapid responding of the equipment
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