Mini LED Wafer Splitting Equipment
After laser cutting, the wafer is in half cutting state, and the grains have not been separated from each other, so the splitting process is needed. This equipment adopts the physical processing mode, to place the wafer on the receiving table, and utilizes the cleat to move up and down to act on the grain cutting track to separate the single grains. The equipment comprises automatic loading and unloading unit, counterpoint unit, wedge receiving unit and hammer unit.
Main Advantage
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01Unattended fully automatic processing which is also applicable for debris
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02Reasonable structure design for quick change of tools
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04With automatic cleaning function for cutter table
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05With automatic compensation knife depth technology
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Equipment Picture
Basic Parameters
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1. Cleavable Product Thickness: 50~300μm
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2. Machinable wafer sizes: 2 ~ 6 inch wafers that can cope with splitting of product with minimum cutting path 12μm
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3. Compatibility: cleavable particle size 02 * 03 ~ 80 * 80mil
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4. Splitting: forward split, reverse split, edge split, middle split, jump split
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5. Easy maintenance of the equipment: utilizing bus control system and self-diagnosis system, with low failure rate, high stability and high maintainability
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6. Design/Manufacturing/Maintenance integration to ensure the consistency, stability and rapid responding of the equipment
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