MX-SLG1C Laser grooving cutting equipment
The equipment utilizes laser grooving and cutting on the surface of a wafer，with humanized operation design to improve user experience and intelligent software system to improve production efficiency.
Equipment Advantage
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01Equipped with high precision linear motor and high speed X-Y motion platform
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02Equipped with special customized laser head, which ensures high cutting quality and low heat influence
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03The software is easy to operate and the equipment is convenient to maintain
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04The cutting mode can be freely combined by narrow beam and wide beam, equipped with a single focus lens cutting system which can improve the processing stability
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Equipment Picture
Basic Parameters
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1. Applicable Products：Low-K, CMOS, etc
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2. Applicable wafer size：200mm-300mm
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3. Laser head：UV nanosecond or short pulse custom laser head
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4. Cutting depth：≥10μm
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5. Cutting speed：0-1000mm/s
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6. Processing method：full-automatic
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7. Cutting width： 30~90μm
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8. Equipped with backlight chuck table which has better edge alignment
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