MX-SSG1A Wafer back grinding equipment
The equipment is applied in grinding semiconductor wafers of various materials，with advanced operation and management system to improve the production efficiency.
Equipment Advantage
-
01Equipped with material information scanning and input system
-
02Equipped wtith wafer level handling robot
-
03Equipped with Fool-proofing system to identify the positive and negative side of the wafer
-
04Equipped with water ring vacuum pump to ensure the stable vacuum and the small vibration
-
05Equipped With a visual management system for the grinding process
-
06Equipped with customized ultra-precision chuck table base，excellent performance, small vibration, that can adapt to different hardness of wafer materials
Equipment Picture
Basic Parameters
-
2. Processing method：full-automatic
-
3. Applicable wafer size: 100mm-200mm
-
4. Final product thickness：80μm
-
5. Grinding speed：0.1μm-50mm/s
-
6. Z-axis minimum stroke：120mm
-
7. Applicable material thickness：≤1800μm
-
8. TTV：≤2.5μm，WTW≤2.5μm，Ra≤0.02μm
-
9.
-
10.
-
11.
-
12.
-
13.
-
14.
-
15.
-
16.
-
17.
-
18.
-
19.
-
20.
-
21.
-
22.
-
23.
-
24.
-
25.
-
26.
-
27.
-
28.
-
29.
-
30.